|
|
遮蔽性能
Shielding Permanence
|
完整个体的特性
Integral Property
|
刮伤涂装层可能会造成缺口天线(遮蔽失败)。 在热循环过程中涂装层可能会分离并且有其它涂装附着性问题。
Scratching the coating may create slot antenna (shield failure).
May delaminate during thermal cycling and other adhesion problems.
|
回收再使用能力
Recyclability
|
可重复使用和可回收再使用
Reusable and recyclable
|
需要剥离程序以移除涂装层,但是此程序会造成必须被丢弃的含有金属成份的"污泥"。
Stripping process removes coating, but this creates metallic "sludge" which must be discarded.
|
零件设计兼容性
Part Design Compatibility
|
能做成复杂的设计
Complex designs
|
能做成较简单的设计(看得见的地方才能做成涂装)
Simpler designs (Line of sight process).
|
制造时间
Lead Times
|
比塑料加上导电涂装方式短。
Lower than Plastics with Conductive Coatings.
|
比EMI遮蔽复合材料方式长
Higher than EMI Shielding Compounds.
|
耐腐蚀性
Corrosion Resistance
|
完整个体的特性
Integral Property
|
铜镀,适用于高导电的涂装,需要上**层保护的表漆。
Copper, favored for highly conductive coatings, requires protective topcoat.
|
成型后的遮蔽处理
Post-Mold Shielding Operations
|
成型后即有遮蔽性。完整个体的特性
Part shielding right out of the mold.
Integral property
|
额外的遮蔽步骤包括:用导电材料涂装和加上遮蔽物(板子,面罩)
Additional shielding steps include: coating part with conductive material and masking.
|
成型中的特别处理
Special Handling During Molding
|
不需要
None
|
为了涂装的附着性必须保持没有污染。
Must be kept free of contaminates for coating to adhere properly.
|
成本
Costs
|
看成本比较范例。
See cost comparison example
|
看成本比较范例。
See cost comparison example
|